This chapter presents the remote powering and conversion mechanisms applied to wireless cortical implants, and more specifically developing the three-layer architecture explained in Chap. 1 . The central implanted unit (CIU), implanted internally, serves as the primary wireless power source for the implant (ASPs), with wireless power delivery achieved through magnetic coupling and the received power must be converted into a stable DC voltage. The design of power conversion units is presented in this chapter. Moreover, developing the power control unit and the automatic resonance tuning system are presented. The design of the wireless power transfer units for the CIU unit is also proposed. The power dissipated inside the implant leads to a temperature elevation in the brain, which may disrupt the normal functioning of the brain. The temperature elevation of the brain implants should be less than 1  \(^\circ \) C according to safety regulations. This temperature elevation equals a power density of 40 mW/cm \(^2\) . The maximum power consumption should be limited to 10 mW to ensure the safe operation of the implanted system.