Exploring the Hot-Diffusion Bonding of Stainless Steel/Aluminum/Stainless Steel-Clad Plate: Microstructural Insights and Deep Drawing Simulation
摘要
A tri-metal stainless-steel/aluminum/stainless-steel (SS/Al/SS) cladding plate, with an aluminum alloy interlayer, was fabricated using hot-diffusion bonding technique. Interface analyses and a deep drawing simulation of the obtained sandwich sheet, providing insights into the efficiency of the bonding and the formability, were investigated. The SEM result revealed that the clad plate has a well-bonded interface without defaults. However, the presence of interrupted intermediate layer, in specific zones of the SS/AL/SS interface, was detected. The elemental analysis (EDS) confirmed the presence of oxide compounds including Al2O3 and Fe2O3 within this layer. The simulation study indicates that the maximum deformations, with a value around 0.391, are located at the radius facing the die’s radius and that the modeled clad plate possesses a good formability. This suggests the potential applicability in various industrial application which require deep drawing process.