Parametric testing is an essential tool in the detection and monitoring of process and plasma damage. The specialized parametric structures described in Chap. 11 need unique parametric test sequences and procedures to maximize the likelihood of damage detection. Ongoing monitoring of a production line is essential to detect process excursions and minimize financial damage. Techniques such as revealing stress can provide quick insights into reliability degradation without extensive reliability testing. This chapter describes parametric testing strategies for the detection of process and plasma damage in many device types, including transistors, metallization, ring oscillators, etc.