This research aims to investigate the deformation mechanisms and mechanical response of a Nb/Cu bilayer thin film under nanoindentation using molecular dynamics (MD) simulations. The specific objectives of this study are to explore the impact of indentation velocity ranging from 10 to 150 m/s on defect formation and hardness, and to understand the correlation between deformation behavior and loading rate. The hypothesis is that lower indentation velocities will result in a load-displacement curve with an initial linear region indicating elastic deformation, while higher velocities will produce a serrated profile, indicating plastic behavior. The relative hardness of the Nb/Cu sample is expected to vary with increasing velocity from 10 m/s to 50 m/s until reaching a certain threshold, beyond which it may increase due to enhanced strain hardening effects. Additionally, the load-displacement curves may show load drops corresponding to specific indentation depths. These drops could be attributed to the occurrence of defects such as atomic rearrangements or dislocation nucleation at critical depths. Analyzing these phenomena will provide valuable insights into the nanoscale mechanical properties of Nb/Cu bilayer thin films and their relationship with indentation velocities.