This chapter applies some qualitative and quantitative methods to the analysis of semiconductor supply chain localization. First, strength, weakness, opportunity and threat (SWOT) analysis, one of the most well-known qualitative methods for formulating and evaluating strategies, is reviewed. Some examples of SWOT analysis applications in various fields are also given. To demonstrate the application of SWOT analysis in the field of semiconductor supply chain localization, a SWOT analysis is conducted on a major foundry in the world to rationalize the foundry’s past choice of building wafer fabs domestically. Subsequently, a SWOT analysis is used again to examine the foundry’s localization attempts around the world. A comparative analysis of the localization plans of its two wafer fabs in two countries is also conducted. In the second part of this chapter, two multi-criteria decision making (MCDM) methods, analytical hierarchy process (AHP) and the technique for order preference by similarity to ideal solution (TOPSIS) are combined to compare the suitabilities of several locations for building the localized wafer fab. To further enhance synergies, SWOT analysis and the AHP-TOPSIS method are jointly applied to qualitatively and quantitatively assess the strengths and weaknesses of multiple locations for building the localized wafer fab.