This study focuses on the optimization of a microchannel heat sink (MCHS) to enhance thermal management performance, particularly for high-performance electronics. The research employs a multi-objective optimization approach, using the Thermal Exchange Optimization (TEO) algorithm to simultaneously minimize thermal resistance and pumping power, key performance metrics for MCHS. The design variables considered are the ratio between the channel width to the channel depth and the ratio between the fin width to the channel depth. Surrogate models were developed using Response Surface Approximation (RSA) to evaluate these objective functions. The optimization process was further validated using the augmented ε-constraint method (AUGMENCON). The results revealed optimal Pareto fronts demonstrating trade-offs between thermal resistance and pumping power, with the TEO algorithm providing a set of diverse solutions. The study demonstrates the effectiveness of using advanced optimization techniques in achieving enhanced cooling efficiency and reduced energy consumption in microchannel heat sinks.