Solid oxide fuel cells (SOFCs), known for their energy efficiency and environmental benefits, have interconnectors made primarily of ferritic stainless steelStainless steel with a high chromium content, as one of the main components. However, interconnectors suffer from chromium (Cr) sublimation issues during high-temperatureTemperature operation, which impacts the durability of SOFC. To prevent Cr sublimation, much research has been focused on applying a proper thin cobaltCobalt (Co) passivation layer to the interconnector surface. In this study, we explored electroplatingElectroplating technology to improve the thickness uniformityThickness uniformity of Co thin filmCo thin film deposited on SOFC interconnector. Several Co thin filmsCo thin film were deposited on a patterned ferritic stainless-steel interconnector through the electroplatingElectroplating processes developed by controlling the organic additivesAdditives in the electrolyte and the current densityDensity, and their local thicknesses for the pattern were compared. In addition, the grain structures (shape and size) and textures of the corresponding positions were measured using an electron backscatter diffraction (EBSD) technique, to understand the roles of the additivesAdditives and current densityDensity in the deposition behavior during electroplatingElectroplating and explain the difference in thickness uniformityThickness uniformity between the films observed. Our results indicate that the thickness uniformityThickness uniformity of Co films electroplated on patterned interconnectors is closely related to the differences in local diffusionDiffusion behavior of Co ions within the pattern which is controlled by the additivesAdditives in the electrolyte or the current densityDensity.