Scholarlink

2.5D FPGAs are already almost 15 years old, and with intensive research and fabrication breakthroughs, 3D FPGAs are coming ever closer to commercial adoption as well. Hence, a book on designing programmable interconnect would not be complete without at least a brief discussion of multi-die devices. Since these topics heavily depend on advanced fabrication, integration, and packaging technologies that are far beyond the scope of this book, our discussion will indeed be brief and focused on how the main developments are changing the perspective on programmable interconnect design and FPGA CAD as we have described it until now.

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Interconnect Design for Multi-die Devices

  • 章节

  • 发表日期：

    2025年

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  • Stefan Nikolić

摘要

2.5D FPGAs are already almost 15 years old, and with intensive research and fabrication breakthroughs, 3D FPGAs are coming ever closer to commercial adoption as well. Hence, a book on designing programmable interconnect would not be complete without at least a brief discussion of multi-die devices. Since these topics heavily depend on advanced fabrication, integration, and packaging technologies that are far beyond the scope of this book, our discussion will indeed be brief and focused on how the main developments are changing the perspective on programmable interconnect design and FPGA CAD as we have described it until now.