Metal foils are being widely used, from the chemical or electronics sector to household appliances. The joining of these foils by adhesive bonding is often the preferred method due to discolouring and warping under the thermal stresses of other joining methods, such as welding. However, long curing times are a disadvantage of adhesive bonding compared to welding. The use of electromagnetic induction is a promising solution for accelerated curing. This work investigates induction heating for accelerated curing of 2C-epoxy adhesives for bonding of thin nickel foils. Process parameters for rapid curing of the adhesives were determined based on reaction kinetics using DSC measurements. According to those results peel test specimens were fabricated, and the peel resistance was evaluated using a 90° peel load. It has been shown that 2C epoxy adhesives can be cured evenly between two nickel foils with the aid of induction heating. Strengths comparable to convective oven curing were achieved.