After elaborating on how the chip-to-chip interface has evolved into the system performance bottleneck, which drives the shift from 2 to 3D integration, this chapter enumerates the merits of TCI, a magnetically coupled interface, over the conventional solution of through-silicon via (TSV). In addition, it proposes a novel sliced bread scheme for massive chip integration and explains its advantages in heat removal, communication (adopting TCI), and power delivery over the conventional approach. The chapter then turns to the author’s vision of connecting our brains to the internet and the possibilities it will create. It closes with an elaboration of synchronous versus asynchronous chip design, followed by a presentation of the history of research on synchronization.