Scholarlink

<p>This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).</p><p>The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

  • 书籍

  • 发表日期：

    2025年

查看全文
  • Chong Leong Gan,
  • Chen Yu Huang

摘要

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).

The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.