Abstract <p>The article presents the research results of the melt kinetics of multicomponent solders during induction heating. It is shown that a high-frequency electromagnetic field has an effect on contact interaction processes of low-melting and high-melting solder components as mainly resistive heating of the particles of the high-melting component and magnetic-dynamic effect on the solder components. In the process of the contact interaction of solder components, they are heated in a nonisothermal mode of the high-melting components dissolution in a low-melting one. The structure formation on the soldered surface that is not typical for cast alloys and the structure similar to cast dispersed and hardened composite materials in soldered seams are the results of such processes. The heating rate of the composite solder and the dissolution value of a high-melting component in a low-melting one have the greatest effect on the structure of a soldered seam.</p>