Optimization of silver content to design electrically and thermally conductive adhesive for space applications
摘要
Electrically and thermally conductive adhesives are advanced materials designed to provide excellent adhesion while ensuring high electrical and thermal conductivity between bonded surfaces. These hybrid systems are formulated by incorporating conductive filler particles such as silver (Ag), gold (Au), copper (Cu), carbon nanotubes, or graphene into the resin matrix. This study focuses on optimizing the loading percentage of silver filler powder in an epoxy resin system to achieve exceptional electrical conductivity, efficient thermal conductivity, and superior adhesive strength. Three formulations were developed by incorporating 54%, 58%, and 62% silver granular powder into the epoxy resin system using a mechanical agitation method. The findings indicate that the 62% Ag composite exhibits outstanding electrical conductivity, excellent thermal conductivity, controlled outgassing behavior, and a lap shear strength of 7.2 MPa, with minimal impact from space environmental conditions. However, the maximum mechanical strength of 8.4 MPa was observed in the 58% Ag composite.
Graphical abstract