Scholarlink

<p>A series of PI aerogel composite films were prepared through adjustments made to the ratio of dianhydride and chemical imidization reagents, the crosslinker content, and the utilization of a non-solvent induced phase separation process. The prepared PI aerogel films exhibited a minimum dielectric constant of 1.39 (10<sup>6</sup>&#xa0;Hz), a maximum water contact angle of 137.8°, and demonstrated excellent recyclability. Furthermore, the prepared polyimide aerogel films demonstrated exceptional thermally stable characteristics, with Td<sub>5%</sub> maintained at approximately 510&#xa0;°C, Tg values remaining above 230&#xa0;°C, and a low coefficient of thermal expansion, at 55.8&#xa0;ppm/K. The prepared PI aerogel films exhibit a high degree of porosity (74.1%), a relatively low density (0.392&#xa0;g/cm<sup>3</sup>), and considerable tensile strength (up to 6.2&#xa0;MPa). It has been demonstrated that these polyimide aerogel films are highly promising for the construction of high-frequency microelectronic devices.</p> Graphical abstract <p></p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Preparation of polyimide aerogel films with high hydrophobicity and low dielectric constant under atmospheric pressure drying conditions

  • 期刊论文

  • 发表日期：

    2025年7月2日

查看全文
  • Xiaodong Wang,
  • Xinrun Yu,
  • Yushan Xu,
  • Juan Yu,
  • Pei Huang

摘要

A series of PI aerogel composite films were prepared through adjustments made to the ratio of dianhydride and chemical imidization reagents, the crosslinker content, and the utilization of a non-solvent induced phase separation process. The prepared PI aerogel films exhibited a minimum dielectric constant of 1.39 (106 Hz), a maximum water contact angle of 137.8°, and demonstrated excellent recyclability. Furthermore, the prepared polyimide aerogel films demonstrated exceptional thermally stable characteristics, with Td5% maintained at approximately 510 °C, Tg values remaining above 230 °C, and a low coefficient of thermal expansion, at 55.8 ppm/K. The prepared PI aerogel films exhibit a high degree of porosity (74.1%), a relatively low density (0.392 g/cm3), and considerable tensile strength (up to 6.2 MPa). It has been demonstrated that these polyimide aerogel films are highly promising for the construction of high-frequency microelectronic devices.

Graphical abstract