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<p>Our research aims to use advanced inspection methodology to scan Wafer Contact Surface (WCS) of Electrostatic Chuck (E-chuck) and study how the topographic structure of WCS affects field application. Polymeric WCS in this study was applied using vacuum lamination process and patterned by lithography to 5 um ± 1 um height. The WCS dimensions were determined by contact profilometry system, while integrity was evaluated by Bruker Contour GTX non-contact optical profilometer. E-chucks are widely used for all major steps of semiconductor process, such as dry etch, ion implantation and PVD, having costly impact on pass/fail rate within over 100&#xa0;k cycles of their lifetime, thus attracting attention to their material development and enhancement of wafer-supporting structure. However, there are fewer studies available about E-chucks WCS and its macro- or micro-structure. Our research will illustrate a library of defects in WCS and discuss the potential effects in OEM&#xa0;(Original Equipment Manufacturer) applications.</p> Graphical abstract <p></p>

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Polymeric wafer contact surface integrity and uniformity of electrostatic chuck: Characterization and potential impact on ion implant process

  • 期刊论文

  • 发表日期：

    2025年1月29日

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  • Yuxuan Liu,
  • Jakub Rybczynski,
  • Isaac Parker,
  • Chandra Venkatraman

摘要

Our research aims to use advanced inspection methodology to scan Wafer Contact Surface (WCS) of Electrostatic Chuck (E-chuck) and study how the topographic structure of WCS affects field application. Polymeric WCS in this study was applied using vacuum lamination process and patterned by lithography to 5 um ± 1 um height. The WCS dimensions were determined by contact profilometry system, while integrity was evaluated by Bruker Contour GTX non-contact optical profilometer. E-chucks are widely used for all major steps of semiconductor process, such as dry etch, ion implantation and PVD, having costly impact on pass/fail rate within over 100 k cycles of their lifetime, thus attracting attention to their material development and enhancement of wafer-supporting structure. However, there are fewer studies available about E-chucks WCS and its macro- or micro-structure. Our research will illustrate a library of defects in WCS and discuss the potential effects in OEM (Original Equipment Manufacturer) applications.

Graphical abstract