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<p>This study investigates the temperature-dependent nanomechanical behavior of pure Cu and Cu-8wt% Al (Cu8Al) using high-temperature nanoindentation. Cu8Al consistently showed lower penetration depths due to solid solution strengthening. Both materials exhibited thermal softening, with reduced hardness and modulus at higher temperatures. Cu8Al displayed a higher elastic recovery index, indicating greater elastic energy storage from dislocation interactions. The findings highlight the role of solute atoms and thermal activation in governing nanoscale mechanical responses under thermal stress.</p> Graphical abstract <p></p>

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High-temperature nanoindentation study of copper–aluminum system

  • 期刊论文

  • 发表日期：

    2025年10月9日

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  • Sandhya Verma,
  • Prakash Sarkar

摘要

This study investigates the temperature-dependent nanomechanical behavior of pure Cu and Cu-8wt% Al (Cu8Al) using high-temperature nanoindentation. Cu8Al consistently showed lower penetration depths due to solid solution strengthening. Both materials exhibited thermal softening, with reduced hardness and modulus at higher temperatures. Cu8Al displayed a higher elastic recovery index, indicating greater elastic energy storage from dislocation interactions. The findings highlight the role of solute atoms and thermal activation in governing nanoscale mechanical responses under thermal stress.

Graphical abstract