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<p>This additive manufacturing (AM) work is focused on developing a new combination of aluminium–copper (Al–Cu) alloys using direct ink writing (DIW) methods for automotive, aerospace, and electrical industry components. The combination of adding Cu in Al at various percentages ranging from 20 to 80% is applied in this work to evaluate the synergistic properties. The microstructure, mechanical properties, and chemical composition of the thermally post-processed parts were studied by Vickers microhardness, X-ray diffraction (XRD), optical microscope, and scanning electron microscope (SEM) with energy dispersive X-ray analysis (EDX). The investigation reveals that the mechanical property, microstructure, and chemical composition depend upon the physical inclusions of Cu with Al. Our results show that 40% Cu composition possesses crucial traits like the hardness of 656 HV due to the formation of AlCu intermetallics without any unwanted oxides.</p> Graphical abstract <p></p>

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Investigation of additive manufacturing based direct ink writing of aluminium–copper alloys

  • 期刊论文

  • 发表日期：

    2024年12月31日

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  • A. Anbarasan,
  • K. Kanthavel,
  • M. Sakthivel

摘要

This additive manufacturing (AM) work is focused on developing a new combination of aluminium–copper (Al–Cu) alloys using direct ink writing (DIW) methods for automotive, aerospace, and electrical industry components. The combination of adding Cu in Al at various percentages ranging from 20 to 80% is applied in this work to evaluate the synergistic properties. The microstructure, mechanical properties, and chemical composition of the thermally post-processed parts were studied by Vickers microhardness, X-ray diffraction (XRD), optical microscope, and scanning electron microscope (SEM) with energy dispersive X-ray analysis (EDX). The investigation reveals that the mechanical property, microstructure, and chemical composition depend upon the physical inclusions of Cu with Al. Our results show that 40% Cu composition possesses crucial traits like the hardness of 656 HV due to the formation of AlCu intermetallics without any unwanted oxides.

Graphical abstract