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<p>COMSOL Multiphysics is an advanced numerical simulation platform increasingly applied in food engineering to model complex Multiphysics phenomena. This review summarizes recent advances in its application for simulating key food processing operations, including thermal treatments (pasteurization, drying, frying), novel heating technologies (microwave, radio frequency, ohmic heating), mass transfer processes (drying, extraction, packaging), microbial inactivation, and chemical reaction modeling. The ability of COMSOL to handle coupled Multiphysics enables predictive modeling of the temperature distribution, moisture migration, reaction kinetics, and microbial safety, thus reducing the reliance on costly and time-consuming experimental trials. However, wider implementation remains constrained by challenges such as variability of food material properties, lack of dedicated food-specific templates and material libraries, requiring customization of general modules, and difficulties in experimental validation. Recent advances, including AI-driven optimization, IoT-enabled real-time monitoring, and digital twin integration, are expanding its potential in food engineering. This review offers guidance for students, researchers, and industry professionals in leveraging computational modeling to accelerate innovation, improve safety, and enhance sustainability. Future perspectives emphasize interdisciplinary integration, multistage simulations, and advanced coupling strategies to overcome current limitations and expand applications in both research and industrial practice.</p> Graphical Abstract <p></p>

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COMSOL multiphysics for food processing: advances, challenges, and future perspectives

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年7月14日

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  • Shuai Wei,
  • Gebremichael Gebremedhin Hailu,
  • Anand Kumar,
  • Eric Banan-Mwine Daliri,
  • Deeban Arumugam,
  • Imran Khan,
  • Sun-Il Choi,
  • Ok-Hwan Lee,
  • Deog-Hwan Oh,
  • Shucheng Liu

摘要

COMSOL Multiphysics is an advanced numerical simulation platform increasingly applied in food engineering to model complex Multiphysics phenomena. This review summarizes recent advances in its application for simulating key food processing operations, including thermal treatments (pasteurization, drying, frying), novel heating technologies (microwave, radio frequency, ohmic heating), mass transfer processes (drying, extraction, packaging), microbial inactivation, and chemical reaction modeling. The ability of COMSOL to handle coupled Multiphysics enables predictive modeling of the temperature distribution, moisture migration, reaction kinetics, and microbial safety, thus reducing the reliance on costly and time-consuming experimental trials. However, wider implementation remains constrained by challenges such as variability of food material properties, lack of dedicated food-specific templates and material libraries, requiring customization of general modules, and difficulties in experimental validation. Recent advances, including AI-driven optimization, IoT-enabled real-time monitoring, and digital twin integration, are expanding its potential in food engineering. This review offers guidance for students, researchers, and industry professionals in leveraging computational modeling to accelerate innovation, improve safety, and enhance sustainability. Future perspectives emphasize interdisciplinary integration, multistage simulations, and advanced coupling strategies to overcome current limitations and expand applications in both research and industrial practice.

Graphical Abstract