<p>In this work, the development of nanoparticles in conducting polymers, such as polyaniline (PANI), was carried out to address stability issues and enhance their heat transfer properties. HCl-doped copper polyaniline (Cl-Cu PANI) nanoparticles and phytic acid-doped copper polyaniline (Ph-Cu PANI) were synthesized using the oxidative polymerization method. The stability of these nanoparticles was examined in water with concentrations of 0.1, 0.2, and 0.3 vol%. Sodium Dodecyl Sulphate (SDS) was used as a surfactant. The nanofluid containing SDS was stable for over 60 days. The characterization of Cl-Cu PANI and Ph-Cu PANI was performed using EDX, TEM, FTIR, XPS, TGA, and DLS. The zeta potential of the 0.2 vol% phytic acid-doped PANI with 0.5 wt% SDS was measured and found to be very stable. Furthermore, the thermal conductivity of Cu-PANI nanofluids with concentrations of 0.1, 0.2, and 0.3 vol% was investigated. The highest thermal conductivity enhancement for Cu PANI nanofluids was found at 0.2 vol% concentration of nanofluid at 20&#xa0;°C. Thermal conductivity ratios for Ph-Cu PANI nanofluid at concentrations of 0.1, 0.2, and 0.3 vol% without surfactant were 1.51, 1.54, and 1.5, respectively, as compared to distilled water. The thermal conductivity values of phytic acid-doped PANI nanofluid without SDS were found to be higher than those of Cl-Cu PANI nanofluid. Due to their improved stability of nanofluids and enhanced thermal conductivity, the currently developed nanoparticles may find usage in numerous heat transfer applications.</p>

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Experimental investigation on the thermal performance of hybrid Cu-PANI nanofluid

  • Krishanu Saha,
  • Uttam Kumar Mandal,
  • Monisha Mridha Mandal

摘要

In this work, the development of nanoparticles in conducting polymers, such as polyaniline (PANI), was carried out to address stability issues and enhance their heat transfer properties. HCl-doped copper polyaniline (Cl-Cu PANI) nanoparticles and phytic acid-doped copper polyaniline (Ph-Cu PANI) were synthesized using the oxidative polymerization method. The stability of these nanoparticles was examined in water with concentrations of 0.1, 0.2, and 0.3 vol%. Sodium Dodecyl Sulphate (SDS) was used as a surfactant. The nanofluid containing SDS was stable for over 60 days. The characterization of Cl-Cu PANI and Ph-Cu PANI was performed using EDX, TEM, FTIR, XPS, TGA, and DLS. The zeta potential of the 0.2 vol% phytic acid-doped PANI with 0.5 wt% SDS was measured and found to be very stable. Furthermore, the thermal conductivity of Cu-PANI nanofluids with concentrations of 0.1, 0.2, and 0.3 vol% was investigated. The highest thermal conductivity enhancement for Cu PANI nanofluids was found at 0.2 vol% concentration of nanofluid at 20 °C. Thermal conductivity ratios for Ph-Cu PANI nanofluid at concentrations of 0.1, 0.2, and 0.3 vol% without surfactant were 1.51, 1.54, and 1.5, respectively, as compared to distilled water. The thermal conductivity values of phytic acid-doped PANI nanofluid without SDS were found to be higher than those of Cl-Cu PANI nanofluid. Due to their improved stability of nanofluids and enhanced thermal conductivity, the currently developed nanoparticles may find usage in numerous heat transfer applications.