Scholarlink

Abstract <p>Silicon-modified urea–formaldehyde fibers (SiUFF) were prepared by adding different proportions of phenyltriethoxysilane to urea–formaldehyde resin, which were then subjected to dry-spinning and curing treatment. The SiUFF were characterized by Fourier infrared spectroscopy, micro-infrared analysis and <sup>13</sup>C nuclear magnetic resonance analysis (<sup>13</sup>C NMR). It was found that the element silicon existed in the form of Si–O bond in the SiUFF, and the hydroxymethyl group cross-linked with the amino group to form methylene at the curing stage, while internal thermal conduction caused surface crosslinking density to exceed that of the fiber core. Optimal performance of SiUFF was achieved with 4 wt % Si-modifier addition, cured at 190°C for 30 min, exhibiting an elongation at break of 7.1%, a tensile strength reaching 389 MPa and a char yield of 30.01% at 1000°C, which represented significant improvements of 96, 92, and 14.2%, respectively compared to the unmodified urea–formaldehyde fiber.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Influence of Silicon Content on the Thermal/Mechanical Performance of Urea–Formaldehyde Fibers

  • 期刊论文

  • 发表日期：

    2025年4月1日

查看全文
  • Kai Yang,
  • Jinbiao Ding,
  • Muen Yang,
  • Jiarui Cao,
  • Yang Liu,
  • Pengyu Li,
  • Mingli Jiao

摘要

Abstract

Silicon-modified urea–formaldehyde fibers (SiUFF) were prepared by adding different proportions of phenyltriethoxysilane to urea–formaldehyde resin, which were then subjected to dry-spinning and curing treatment. The SiUFF were characterized by Fourier infrared spectroscopy, micro-infrared analysis and 13C nuclear magnetic resonance analysis (13C NMR). It was found that the element silicon existed in the form of Si–O bond in the SiUFF, and the hydroxymethyl group cross-linked with the amino group to form methylene at the curing stage, while internal thermal conduction caused surface crosslinking density to exceed that of the fiber core. Optimal performance of SiUFF was achieved with 4 wt % Si-modifier addition, cured at 190°C for 30 min, exhibiting an elongation at break of 7.1%, a tensile strength reaching 389 MPa and a char yield of 30.01% at 1000°C, which represented significant improvements of 96, 92, and 14.2%, respectively compared to the unmodified urea–formaldehyde fiber.