Degradation of Thermal Conductivity of Epoxy-Resin-Based Composites with a Diamond Filler under Irradiation
摘要
A method for irradiating samples of dielectric composites based on epoxy resins and diamond fillers, intended for adhesive joints in heat removal circuits of microelectronic devices operating in high-radiation fields, is described. It is based on placing the samples inside a massive lead target, which is subsequently irradiated with an intense proton beam at an energy of 660 MeV. The dose accumulated by the samples from the interaction with primary and secondary particles is evaluated using mutually complementing FLUKA and MCNPX models. The results obtained are compared with each other and with dose estimates derived from the induced activity of the Na22 isotope in monitor aluminum foils accompanying the irradiated samples. The primary parameter analyzed is the thermal conductivity of the samples, which degrades under irradiation.