Scholarlink

Abstract <p>Problems associated with reduced reliability of electronic systems exposed to elevated temperatures highlight the criticality of heat dissipation. Recently, developers have shown great interest in carbon-based composite thermal-conducting materials. The superior performance of these composites is due to their structural and physical properties. This paper examines the analytical modeling of temperature field distribution in a composite plate. The modeling is performed by solving a time-dependent problem for an orthotropic plate subjected to heat flow. The calculation is performed for a carbon-fiber plate.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Physical and Mathematical Modeling of Heat Transfer in an Orthotropic Plate under Real Dynamic Thermal Influence

  • 期刊论文

  • 发表日期：

    2026年1月1日

查看全文
  • A. V. Babaytsev,
  • S. A. Kolesnik,
  • N. A. Tushavin

摘要

Abstract

Problems associated with reduced reliability of electronic systems exposed to elevated temperatures highlight the criticality of heat dissipation. Recently, developers have shown great interest in carbon-based composite thermal-conducting materials. The superior performance of these composites is due to their structural and physical properties. This paper examines the analytical modeling of temperature field distribution in a composite plate. The modeling is performed by solving a time-dependent problem for an orthotropic plate subjected to heat flow. The calculation is performed for a carbon-fiber plate.