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<p>This article has been retracted. Please see the Retraction Notice for more detail: https://doi.org/10.1134/S1063739726010014</p>

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Retraction Note: Impact of Various Core Materials on the Behavior of Through-Silicon via (TSV) Inductor in a DC/DC Converter

  • 期刊论文

  • 发表日期：

    2026年2月1日

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  • Katepogu Rajkumar,
  • J. Shena Latha,
  • Bujjibabu Nannepaga,
  • G. Umamaheswara Reddy

摘要

This article has been retracted. Please see the Retraction Notice for more detail: https://doi.org/10.1134/S1063739726010014