Abstract <p>Fatigue life prediction was carried out based on the observation of the region of maximum stress and the extent of the cross-section deformation occurring during the operation of the chip inductor. The three-dimensional model of the chip inductor was obtained and the stresses generated inside the device operating under various load conditions, i.e., mechanical bending and temperature cycling, were considered separately and together with varying turns. The stresses generated inside the device were recorded relatively large in the solder region compared to other parts, which was considered to be the main reason for the device failure. With increasing number of turns of the device, with increasing applied load, the fatigue life of the chip inductor decreased, and the fatigue life of the chip inductor with 10 turns was the least when the bending and temperature four cycles were tested.</p>