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Abstract <p>The finite element method is used to simulate four designs of three-dimensional microinductors, produced by self-assembly using residual mechanical stress. During the simulation, the deformation of blanks made of 300-nm-thick Cr film is calculated, in specified areas of which a mechanical stress gradient is formed. The inductance of the obtained microinductors is also determined using the finite element method.</p>

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Simulation of the Self-Assembly of Microinductors Produced by Residual Mechanical Stress

  • 期刊论文

  • 发表日期：

    2025年8月1日

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  • A. S. Babushkin,
  • R. V. Selyukov

摘要

Abstract

The finite element method is used to simulate four designs of three-dimensional microinductors, produced by self-assembly using residual mechanical stress. During the simulation, the deformation of blanks made of 300-nm-thick Cr film is calculated, in specified areas of which a mechanical stress gradient is formed. The inductance of the obtained microinductors is also determined using the finite element method.