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Abstract <p>The article is devoted to the modernization of the micromarking device based on a commercially available CNC2418 engraving machine. The purpose of the upgrade is to reduce the size of individual marking imprints. It is proposed to increase the accuracy of the movement of the tungsten probe in the vertical direction and to control its contact with the surface. A mechanical reduction gear is described that reduces the drives step value along the vertical axis from 10 to 1.5 μm and consists of a cantilevered piezoelectric plate and a cylindrical spring connected to a step drive. Three methods for monitoring the contact of the marker probe with the sample surface, based on measuring the electromechanical parameters of the piezoelectric plate and using a widely available oscilloscope or a multimeter, are described. The application of the proposed solutions allowed to reduce the area of individual marking imprints by 1.9 times.</p>

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Upgraded Micromarker Based on Engraving Machine

  • 期刊论文

  • 发表日期：

    2025年8月1日

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  • E. Yu. Shelkovnikov,
  • P. V. Gulyaev,
  • K. S. Ermolin

摘要

Abstract

The article is devoted to the modernization of the micromarking device based on a commercially available CNC2418 engraving machine. The purpose of the upgrade is to reduce the size of individual marking imprints. It is proposed to increase the accuracy of the movement of the tungsten probe in the vertical direction and to control its contact with the surface. A mechanical reduction gear is described that reduces the drives step value along the vertical axis from 10 to 1.5 μm and consists of a cantilevered piezoelectric plate and a cylindrical spring connected to a step drive. Three methods for monitoring the contact of the marker probe with the sample surface, based on measuring the electromechanical parameters of the piezoelectric plate and using a widely available oscilloscope or a multimeter, are described. The application of the proposed solutions allowed to reduce the area of individual marking imprints by 1.9 times.