Scholarlink

<p>In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293–303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

A high-precision 1 × 15 infrared temperature measurement linear array based on thermopile sensors

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年7月8日

查看全文
  • Jindong Bai,
  • Wenhang Yang,
  • Shouzheng Zhu,
  • Haijun Jin,
  • Yuchen Zhang,
  • Ke Jin,
  • Xiaoshuai Liu,
  • Chunlai Li,
  • Jianyu Wang,
  • Hongxing Qi,
  • Shijie Liu

摘要

In applications such as those in the semiconductor industry, precise temperature measurements with low power consumption are crucial. This article presents a novel noncontact temperature measurement method with low power consumption and high precision, and a thermopile sensor-based linear array for surface temperature measurements is used in semiconductor manufacturing and temperature calibration applications. The array consists of 15 thermopile sensors, a negative temperature coefficient (NTC) thermistor, an FPGA control board with a fiber optic interface, and a motion module. Moreover, the total power consumption of the board is less than 1.5 W. On the FPGA control board, a multiparameter temperature compensation algorithm is used to address intrinsic temperature differences and consistency errors among the sensors. Compared with the traditional two-point calibration method, the temperature measurement accuracy of the proposed method reaches 26 mK in the temperature range of 293–303 K, the maximum repeatability error of the sensor is less than 5.5 mK, and the non-uniformity error between 15 sensors is less than 11.9 mK. The array and its replicas were subjected to more than 6 h of rigorous testing, demonstrating their high stability, with the reduction in accuracy not exceeding 1.5 mK.