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<p>The escalating demand for secure data transmission has positioned encryption technologies at the forefront of information protection. Conventional encryption systems, purely hardware or software-based, face limitations in encryption-depth, dynamic-erasability, and resistance to data leakage. Photonics-based hardware approaches employing nano- and micro-structures offer dynamic-erasure but suffer from complex network rearrangement and low fabrication precision. Here, we showcase a controlled thermal-process strategy for fabricating large-area, dynamically-tunable, 1D, 2D and 3D ordered microstructures on diverse thin-films including optical-glasses, metals and polymers. By controlled tuning of temperature, thermal expansion coefficients, surface energy, Young’s modulus, and film thickness, we show a precise control on their arrangement, thus enabling the fabrication of uniform, periodic patterns over large areas on soft substrates. Leveraging this capability, we demonstrate a hybrid multilevel encryption platform that synergistically combines hardware and software strengths while eliminating their respective shortcomings, achieving remarkable scalability, tunability, and dynamic-erasure, with very low decryption probabilities of 10⁻⁵³ and 10⁻¹⁵⁵ for 16 and 36 pixels, respectively.</p>

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Thermally engineered multilevel hybrid encryption device with dynamic erasure and high data concealment capacity

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年5月28日

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  • Srijeeta Biswas,
  • Renu Raman Sahu,
  • Omkar Deokinandan Nayak Shinkre,
  • Shubham Meena,
  • Ramnishanth S,
  • Mark Vailshery,
  • Tapajyoti Das Gupta

摘要

The escalating demand for secure data transmission has positioned encryption technologies at the forefront of information protection. Conventional encryption systems, purely hardware or software-based, face limitations in encryption-depth, dynamic-erasability, and resistance to data leakage. Photonics-based hardware approaches employing nano- and micro-structures offer dynamic-erasure but suffer from complex network rearrangement and low fabrication precision. Here, we showcase a controlled thermal-process strategy for fabricating large-area, dynamically-tunable, 1D, 2D and 3D ordered microstructures on diverse thin-films including optical-glasses, metals and polymers. By controlled tuning of temperature, thermal expansion coefficients, surface energy, Young’s modulus, and film thickness, we show a precise control on their arrangement, thus enabling the fabrication of uniform, periodic patterns over large areas on soft substrates. Leveraging this capability, we demonstrate a hybrid multilevel encryption platform that synergistically combines hardware and software strengths while eliminating their respective shortcomings, achieving remarkable scalability, tunability, and dynamic-erasure, with very low decryption probabilities of 10⁻⁵³ and 10⁻¹⁵⁵ for 16 and 36 pixels, respectively.