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<p>Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling. However, the practical application of TECs remains limited due to insufficient cooling performance. Here, we present an integrated water-cooled TEC (i-TEC) with internal flow channels embedded in ceramic substrates, effectively eliminating the limitations of traditional thermal interfaces. The i-TEC achieves superior cooling performance, reducing the temperature of an 80 W heat source by nearly 20 °C compared to conventional TECs and attaining a coefficient of performance up to 3.26. Practical applications demonstrate its capability to lower the maximum temperature of a smartphone by up to 16 °C, significantly enhancing user experience and device stability. These results highlight the great potential of these <i>i</i>-TECs for advanced thermal management in electronic devices.</p>

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High-performance integrated thermoelectric coolers for electronics cooling

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年6月5日

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  • Wusheng Fan,
  • Zan Wu,
  • Sihui Hong,
  • Kuang Sheng

摘要

Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling. However, the practical application of TECs remains limited due to insufficient cooling performance. Here, we present an integrated water-cooled TEC (i-TEC) with internal flow channels embedded in ceramic substrates, effectively eliminating the limitations of traditional thermal interfaces. The i-TEC achieves superior cooling performance, reducing the temperature of an 80 W heat source by nearly 20 °C compared to conventional TECs and attaining a coefficient of performance up to 3.26. Practical applications demonstrate its capability to lower the maximum temperature of a smartphone by up to 16 °C, significantly enhancing user experience and device stability. These results highlight the great potential of these i-TECs for advanced thermal management in electronic devices.