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<p>Solution-processed electronics based on two-dimensional materials rely on the deposition of high-quality nanosheet networks to produce high-performance devices, but creating devices with performance approaching the intrinsic limits of the 2D material requires structures that resemble bulk crystal conditions. This Perspective compares two assembly techniques that have achieved this by decoupling in-plane packing and out-of-plane stacking: spin coating and liquid-interface deposition. By outlining their respective strengths and limitations, we provide an overview on selecting appropriate deposition strategies to advance high-performance large-area electronics.</p>

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Reconstructing bulk crystal-like structures via solution assembly of 2D nanosheets

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年4月1日

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  • Joseph Neilson,
  • Adam G. Kelly

摘要

Solution-processed electronics based on two-dimensional materials rely on the deposition of high-quality nanosheet networks to produce high-performance devices, but creating devices with performance approaching the intrinsic limits of the 2D material requires structures that resemble bulk crystal conditions. This Perspective compares two assembly techniques that have achieved this by decoupling in-plane packing and out-of-plane stacking: spin coating and liquid-interface deposition. By outlining their respective strengths and limitations, we provide an overview on selecting appropriate deposition strategies to advance high-performance large-area electronics.