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<p>Heat sinks play a very important role in the functioning of electronic devices such as central processing units and graphics processing units by ensuring that they operate at optimal temperatures and do not overheat. Even though there have been many studies on thermal management systems, even more investigations are needed to understand the performance of advanced heat sinks. Thermal load management is a big challenge to conventional heat sinks in compact electronic devices and high-performance systems. In this study, we will consider the design and thermal performance analysis of new heat sinks which are developed based on natural heat dissipation processes in various microelectronic devices. Computational fluid dynamics is used in the analysis of the thermal performance of six types of heat sinks. The parameters analysed in this analysis include heat dissipation efficiency, temperature distribution, thermal conductivity and Nusselt number. The numerical simulation involves conjugate heat transfer analysis with the help of SST k-ω turbulence model to account for the turbulence flow. Our results have revealed that the ‘Snake Scale’ heat sink is the most efficient type of heat sink with a 26.36% reduction in maximum temperature, a 41.2% decrease in resistance and a 16.9% increase in Nusselt number.</p>

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Sustainable computational fluid dynamics optimization of heat sink performance for energy efficient device cooling

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年7月31日

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  • K. Shunmugesh,
  • Emmanuel Igumbor,
  • S. Arun,
  • Abhijit Bhowmik,
  • Jeewan Singh,
  • Bethelehem Burju Bukate

摘要

Heat sinks play a very important role in the functioning of electronic devices such as central processing units and graphics processing units by ensuring that they operate at optimal temperatures and do not overheat. Even though there have been many studies on thermal management systems, even more investigations are needed to understand the performance of advanced heat sinks. Thermal load management is a big challenge to conventional heat sinks in compact electronic devices and high-performance systems. In this study, we will consider the design and thermal performance analysis of new heat sinks which are developed based on natural heat dissipation processes in various microelectronic devices. Computational fluid dynamics is used in the analysis of the thermal performance of six types of heat sinks. The parameters analysed in this analysis include heat dissipation efficiency, temperature distribution, thermal conductivity and Nusselt number. The numerical simulation involves conjugate heat transfer analysis with the help of SST k-ω turbulence model to account for the turbulence flow. Our results have revealed that the ‘Snake Scale’ heat sink is the most efficient type of heat sink with a 26.36% reduction in maximum temperature, a 41.2% decrease in resistance and a 16.9% increase in Nusselt number.