<p>Complementary (C) FETs enable superior scaling and electrostatics for sub-3&#xa0;nm nodes but the increased Si/dielectric interface reliability a critical concern, and its impact on Tree-shaped CFETs is investigated for the first time in this work. The Si/dielectric interface trap density (N<sub>it</sub>) is varied from 1 to 9 × 10<sup>12</sup> cm<sup>− 2</sup> for both acceptor and donor traps to evaluate their influence on digital, analog, RF, and circuit characteristics. With increasing N<sub>it</sub>, in the n-type (p-type) device, acceptor (donor) traps repel electrons (holes), reducing I<sub>ON</sub> while suppressing I<sub>OFF</sub> by ~ 5 orders, improving the I<sub>ON</sub>/I<sub>OFF</sub> ratio. In p-type (n-type) device acceptor (donor) traps attract holes (electrons), increasing I<sub>ON</sub> by ~ 68% (~ 58%) but reducing the ratio to 10<sup>2</sup> due to higher leakages. Notably, when the N<sub>it</sub> exceeds 4 × 10<sup>12</sup> cm<sup>− 2</sup>, the switching ratio deteriorates below 10<sup>4</sup> for donor (acceptor) traps in the n-type (p-type) device due to pronounced trap-assisted leakage. The findings demonstrate that the Tree-shaped CFET maintains strong electrostatic integrity till ≤ 4 × 10<sup>12</sup> cm<sup>− 2</sup> and stable analog/RF behavior even under severe Si/dielectric interface trap perturbations. The Tree-CFET CMOS inverter shows robust circuit behavior with ~ 2.9 ps delay at moderate trap densities, highlighting the need for precise interface engineering for sub-3&#xa0;nm nodes.</p>

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Role of Si/dielectric interface traps on the reliability of tree-shaped complementary FETs for sub-3 nm technology nodes

  • S. Shreyas Thanthri,
  • Sresta Valasa,
  • Venkata Ramakrishna Kotha,
  • B. Mounika,
  • Narendar Vadthiya

摘要

Complementary (C) FETs enable superior scaling and electrostatics for sub-3 nm nodes but the increased Si/dielectric interface reliability a critical concern, and its impact on Tree-shaped CFETs is investigated for the first time in this work. The Si/dielectric interface trap density (Nit) is varied from 1 to 9 × 1012 cm− 2 for both acceptor and donor traps to evaluate their influence on digital, analog, RF, and circuit characteristics. With increasing Nit, in the n-type (p-type) device, acceptor (donor) traps repel electrons (holes), reducing ION while suppressing IOFF by ~ 5 orders, improving the ION/IOFF ratio. In p-type (n-type) device acceptor (donor) traps attract holes (electrons), increasing ION by ~ 68% (~ 58%) but reducing the ratio to 102 due to higher leakages. Notably, when the Nit exceeds 4 × 1012 cm− 2, the switching ratio deteriorates below 104 for donor (acceptor) traps in the n-type (p-type) device due to pronounced trap-assisted leakage. The findings demonstrate that the Tree-shaped CFET maintains strong electrostatic integrity till ≤ 4 × 1012 cm− 2 and stable analog/RF behavior even under severe Si/dielectric interface trap perturbations. The Tree-CFET CMOS inverter shows robust circuit behavior with ~ 2.9 ps delay at moderate trap densities, highlighting the need for precise interface engineering for sub-3 nm nodes.