Geometry-aware localization evaluation of grad-CAM for wafer map defect classification
摘要
This study investigated the localization accuracy of Grad-CAM as an Explainable AI (XAI) technique for industrial inspection, specifically evaluating it on the WM811K semiconductor wafer defect dataset — a large-scale, publicly available collection of 25,519 labeled wafer maps. Localization performance was measured using the Top-10% Intersection over Union (IoU) metric on a held-out test sample (