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<p>The Coaxial-Like through-glass vias (TGVs) are frequently used vertical interconnect transmission structures in radio frequency (RF) three-dimensional(3D) integrated circuits (ICs). This paper addresses the TGV’s structure in high-density 3D packaging by proposing a multi-parameter co-optimization methodology that integrates electromagnetic modeling, response surface methodology (RSM), and genetic algorithm (GA), significantly enhancing its high-frequency transmission performance. Innovatively, a 3D full-wave electromagnetic simulation model of the coaxial-like TGV is established to systematically analyze the influence of via pitch<i> p</i>, via radius <i>r</i>, and number of ground vias n on the insertion loss S21. An analytical model for RLGC parasitic parameters based on electromagnetic theory is derived. A second-order response surface model correlating S21 with key structural parameters is constructed via Box-Behnken experimental design, and globally optimized using a genetic algorithm, resulting in an optimized parameter set (<i>p</i> = 82.05&#xa0;μm,<i> r</i> = 10.44&#xa0;μm, <i>n</i> = 10) for S21 at 100&#xa0;GHz. Simulation results verify that the optimized S21 improves by 0.0052&#xa0;dB compared to the baseline model, with a relative enhancement of 21.94%. This study not only provides a theoretical foundation and optimization framework for high-performance TGV design, but also offers an effective solution for low-loss interconnects in 3D integrated RF devices.</p>

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High-frequency characteristics analysis and optimization of coaxial-like TGVs

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年1月7日

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  • Shouwei Chen,
  • Jin Wang,
  • Xingpeng Liu,
  • Xiaoping Wu,
  • Jie Liu,
  • Dawen Xia

摘要

The Coaxial-Like through-glass vias (TGVs) are frequently used vertical interconnect transmission structures in radio frequency (RF) three-dimensional(3D) integrated circuits (ICs). This paper addresses the TGV’s structure in high-density 3D packaging by proposing a multi-parameter co-optimization methodology that integrates electromagnetic modeling, response surface methodology (RSM), and genetic algorithm (GA), significantly enhancing its high-frequency transmission performance. Innovatively, a 3D full-wave electromagnetic simulation model of the coaxial-like TGV is established to systematically analyze the influence of via pitch p, via radius r, and number of ground vias n on the insertion loss S21. An analytical model for RLGC parasitic parameters based on electromagnetic theory is derived. A second-order response surface model correlating S21 with key structural parameters is constructed via Box-Behnken experimental design, and globally optimized using a genetic algorithm, resulting in an optimized parameter set (p = 82.05 μm, r = 10.44 μm, n = 10) for S21 at 100 GHz. Simulation results verify that the optimized S21 improves by 0.0052 dB compared to the baseline model, with a relative enhancement of 21.94%. This study not only provides a theoretical foundation and optimization framework for high-performance TGV design, but also offers an effective solution for low-loss interconnects in 3D integrated RF devices.