<p>The compression molding process of polymer bonded explosive (PBX) is a typical black-box process. It is of great significance to study the compression molding of PBX for safe production and high-quality molding. A two-dimensional mesoscopic model of polygonal crystal based on Python code is developed to analyze the mechanical behavior of granular simulated explosives compression molding. The influence of friction on the reaction force of discharge head and the crystal breakage rate is obtained through the differentiation study with different friction coefficients. It is found that when the friction coefficient is 0.3, the reaction force is 35.5% higher than that without friction, and the crystal damage rate is increased by 13.6%. By analyzing the change of crystal temperature, it can be known that the temperature of the crystal increases by 32.7℃ after compression, and it can be speculated that the hot spots are generated by the friction between the mold wall and the crystal as well as the breakage of chemical bond when the crystal is broken.</p>

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Research on the mechanical behavior of compression molding for simulated polymer-bonded explosives

  • Xiaoyang Wu,
  • Jun Tao,
  • Bo Wang,
  • Haichao Ren,
  • Yiping Wang

摘要

The compression molding process of polymer bonded explosive (PBX) is a typical black-box process. It is of great significance to study the compression molding of PBX for safe production and high-quality molding. A two-dimensional mesoscopic model of polygonal crystal based on Python code is developed to analyze the mechanical behavior of granular simulated explosives compression molding. The influence of friction on the reaction force of discharge head and the crystal breakage rate is obtained through the differentiation study with different friction coefficients. It is found that when the friction coefficient is 0.3, the reaction force is 35.5% higher than that without friction, and the crystal damage rate is increased by 13.6%. By analyzing the change of crystal temperature, it can be known that the temperature of the crystal increases by 32.7℃ after compression, and it can be speculated that the hot spots are generated by the friction between the mold wall and the crystal as well as the breakage of chemical bond when the crystal is broken.