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<p>Sustainable thermal management of high-heat-flux electronics beyond Moore’s Law requires micro thermoelectric coolers (μ-TECs) that are both high-performance and environmentally sustainable. However, state-of-the-art μ-TECs rely on Bi<sub>2</sub>Te<sub>3</sub>-based materials, whose tellurium scarcity, toxicity concerns and limited mechanical robustness hinder widespread adoption. Mg-based thermoelectric materials offer a promising alternative but remain challenging to integrate into microscale devices. Here we show that a low-temperature, water-free fabrication strategy enables tellurium-minimized μ-TECs based on <i>n</i>-type Mg<sub>3</sub>(Bi,Sb)<sub>2</sub> and <i>p</i>-type MgAgSb. Using magnetron sputtering as a cold bonding approach, we fabricate compact 12-pair microdevices (2.95 × 4.35 × 1.4 mm<sup>3</sup>), with thermoelectric legs approximately 3% the size of previously reported Mg-based devices. The resulting μ-TECs achieve a power density of 4.34 W cm<sup>−2</sup> and a packing density of 93.5 pairs cm<sup>−2</sup>. Our work establishes a scalable route for sustainable thermoelectric cooling and a viable alternative to conventional Bi<sub>2</sub>Te<sub>3</sub> technologies.</p>

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A low-temperature, water-free fabrication route to Mg-based micro thermoelectric coolers for thermal management

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年7月2日

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  • Jiawei Yang,
  • Rui Zhu,
  • Ming Li,
  • Zengxia Mei,
  • Ling Chen,
  • Li-Ming Wu

摘要

Sustainable thermal management of high-heat-flux electronics beyond Moore’s Law requires micro thermoelectric coolers (μ-TECs) that are both high-performance and environmentally sustainable. However, state-of-the-art μ-TECs rely on Bi2Te3-based materials, whose tellurium scarcity, toxicity concerns and limited mechanical robustness hinder widespread adoption. Mg-based thermoelectric materials offer a promising alternative but remain challenging to integrate into microscale devices. Here we show that a low-temperature, water-free fabrication strategy enables tellurium-minimized μ-TECs based on n-type Mg3(Bi,Sb)2 and p-type MgAgSb. Using magnetron sputtering as a cold bonding approach, we fabricate compact 12-pair microdevices (2.95 × 4.35 × 1.4 mm3), with thermoelectric legs approximately 3% the size of previously reported Mg-based devices. The resulting μ-TECs achieve a power density of 4.34 W cm−2 and a packing density of 93.5 pairs cm−2. Our work establishes a scalable route for sustainable thermoelectric cooling and a viable alternative to conventional Bi2Te3 technologies.