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<p>Gallium-based liquid metals (LMs) are promising materials for stretchable electronics due to their metallic conductivity and deformability. However, the fabrication of large-area stretchable integrated electronics using LMs on various polymers remains challenging due to their high surface tension, fluidity, and poor wettability. Current techniques, such as selective wetting and lift-off processes, face limitations related to substrate compatibility and Ga/metal alloying, hindering their applicability in integrated electronic systems. To address these challenges, we developed a high-resolution top-down etching-based photolithography combined with a universal cryogenic transfer method for transferring patterned LM particles (LMPs) in various polymer substrates. The cryogenic environment modifies the interfacial bonding between the LMPs and substrates, resulting in a universal transfer. The resulting liquid metal particle network embedded polymer (LNEP) exhibits high electrical conductivity (~1.71 × 10⁶ S/m), stability, and strain-insensitive performance across various polymers. This process is scalable to large-area fabrication, overcoming the limitations of existing LM patterning techniques. Leveraging this approach, we demonstrated the use of LNEP ranging from skin-conformal wearable sensors to hybrid stretchable circuits and implantable devices, demonstrating the universality of the method. This technique establishes a scalable pathway for stretchable electronics in advanced applications.</p>

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Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年2月26日

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  • Do Hoon Lee,
  • Seungkyu Lee,
  • Minyong Park,
  • Junehyeok Kim,
  • Hanbit Jin,
  • Su Yeong Kim,
  • Donghyun Lee,
  • Young-Soo Lim,
  • Jun Chang Yang,
  • Taehoon Lee,
  • Byungkook Oh,
  • Sang Yu Sun,
  • Do-Wan Kim,
  • Sihong Wang,
  • Sung Gap Im,
  • Hye Jin Kim,
  • Sung-Min Park,
  • Jihan Kim,
  • Yang-Kyu Choi,
  • Steve Park

摘要

Gallium-based liquid metals (LMs) are promising materials for stretchable electronics due to their metallic conductivity and deformability. However, the fabrication of large-area stretchable integrated electronics using LMs on various polymers remains challenging due to their high surface tension, fluidity, and poor wettability. Current techniques, such as selective wetting and lift-off processes, face limitations related to substrate compatibility and Ga/metal alloying, hindering their applicability in integrated electronic systems. To address these challenges, we developed a high-resolution top-down etching-based photolithography combined with a universal cryogenic transfer method for transferring patterned LM particles (LMPs) in various polymer substrates. The cryogenic environment modifies the interfacial bonding between the LMPs and substrates, resulting in a universal transfer. The resulting liquid metal particle network embedded polymer (LNEP) exhibits high electrical conductivity (~1.71 × 10⁶ S/m), stability, and strain-insensitive performance across various polymers. This process is scalable to large-area fabrication, overcoming the limitations of existing LM patterning techniques. Leveraging this approach, we demonstrated the use of LNEP ranging from skin-conformal wearable sensors to hybrid stretchable circuits and implantable devices, demonstrating the universality of the method. This technique establishes a scalable pathway for stretchable electronics in advanced applications.