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<p>Conformable organic thin-film transistors (OTFTs) are identified as a core electronic component for next-generation wearable and implantable electronics. However, the lack of high-level integration of high-performance conformable devices remains a major obstacle to the commercialization of organic transistors. Here, a universal and non-destructive dual protective layer photolithography strategy is proposed, which is compatible with all organic materials, including conductors, semiconductors and insulators, with pattern precision of 0.5 µm. This approach enables the fabrication of ultrahigh-density OTFTs that demonstrate a mobility of 2.21 cm<sup>2</sup>V<sup>-1</sup>s<sup>-1</sup> at a density of 64,288 transistors/cm<sup>2</sup>, scalable to scaled up to 5,120,000 transistors/cm<sup>2</sup> while maintaining a mobility of ~1 cm<sup>2</sup>V<sup>-1</sup>s<sup>-1</sup>. Moreover, the devices show remarkable stability (10,000 switching cycles/100,000 folding cycles) and have been successfully integrated into sub-micron circuits and flexible displays, demonstrating strong application potential. This work offers a universal wafer-level manufacturing and integration pathway for ultrahigh-density, high-performance conformable devices, advancing the industrialization of conformable electronics.</p>

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Superintegrated conformable organic transistors based on a universal microlithographic strategy

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年10月20日

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  • Yanping Ni,
  • Xiaoli Zhao,
  • Chuang Xue,
  • Jing Sun,
  • Fanjunjie Han,
  • Junru Zhang,
  • Pengbo Xi,
  • Yanhong Tong,
  • Qingxin Tang,
  • Yichun Liu

摘要

Conformable organic thin-film transistors (OTFTs) are identified as a core electronic component for next-generation wearable and implantable electronics. However, the lack of high-level integration of high-performance conformable devices remains a major obstacle to the commercialization of organic transistors. Here, a universal and non-destructive dual protective layer photolithography strategy is proposed, which is compatible with all organic materials, including conductors, semiconductors and insulators, with pattern precision of 0.5 µm. This approach enables the fabrication of ultrahigh-density OTFTs that demonstrate a mobility of 2.21 cm2V-1s-1 at a density of 64,288 transistors/cm2, scalable to scaled up to 5,120,000 transistors/cm2 while maintaining a mobility of ~1 cm2V-1s-1. Moreover, the devices show remarkable stability (10,000 switching cycles/100,000 folding cycles) and have been successfully integrated into sub-micron circuits and flexible displays, demonstrating strong application potential. This work offers a universal wafer-level manufacturing and integration pathway for ultrahigh-density, high-performance conformable devices, advancing the industrialization of conformable electronics.