<p>This paper presents a unique boundary element method (BEM) for assessing thermal stress sensitivity in functionally graded materials (FGMs) under non-Fourier heat conduction conditions. Unlike standard approaches that assume classical Fourier heat conduction, this study uses the Cattaneo-Vernotte heat conduction model to better describe the transient thermal response in FGMs under rapid thermal loading. The suggested method is unusual in that it blends a dual-reciprocity BEM (DRBEM) with non-Fourier models, allowing for high-precision, boundary-only analysis of complicated graded materials without the need for internal discretization. This framework sheds new light on the thermal stress sensitivity distribution in FGMs, which is critical for the development of sophisticated components for aeronautical, nuclear, and microelectronic applications. First, the non-Fourier temperature field was calculated by solving the non-Fourier heat conduction equation using the dual reciprocity technique. The precise integration technique (PIM) was used to numerically integrate the PCE differential equations, which produced consistent and accurate results. Second, the displacement field can be determined by solving the discretized fuzzy boundary integral equation. Third, the non-Fourier thermal stresses are determined by combining the non-Fourier temperature and displacement fields. Finally, the non-Fourier thermal stress sensitivity was governed by the non-Fourier thermal stress. A comparison of the results to those accessible in the literature demonstrates that the proposed model is correct and valid.</p>