<p>Al–Mg–Si alloys have been widely used in industry due to their excellent formability, good strength, and electrical conductivity. However, they face challenges in meeting the requirements for high-temperature performance. In this work, the effects of rhenium (Re) addition (0, 0.1, and 0.3 wt%) on the microstructure, electrical conductivity, and tensile properties of annealed Al–Mg–Si cold rolled sheets were investigated. A texture index (XCB) was introduced to quantify texture evolution. The results show that Re addition increases the hardness of the annealed samples but reduces their electrical conductivity and overall texture intensity. The Al<sub>6</sub>(FeMn, Re) phase pins grain boundaries and enhances the thermal stability of the microstructure of the annealed samples. The Cube<sub>ND</sub> texture {φ1 = 20°, φ = 0°, φ2 = 0°} exhibits high thermal stability. The formation of submicron dimple bands (SDB) and reinforced tear edges (RTE) contributes to improving the room-temperature and high-temperature tensile strength of the alloy.</p>

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Effect of rhenium (Re) addition on the microstructure evolution, electrical conductivity and tensile properties of Al–Mg–Si alloy

  • Xinhao Zhao,
  • Fanghua Shen,
  • Huabiao Chen,
  • Zhenzhong Sun,
  • Yuxun Zhang,
  • Danqing Yi,
  • Yingfen Li

摘要

Al–Mg–Si alloys have been widely used in industry due to their excellent formability, good strength, and electrical conductivity. However, they face challenges in meeting the requirements for high-temperature performance. In this work, the effects of rhenium (Re) addition (0, 0.1, and 0.3 wt%) on the microstructure, electrical conductivity, and tensile properties of annealed Al–Mg–Si cold rolled sheets were investigated. A texture index (XCB) was introduced to quantify texture evolution. The results show that Re addition increases the hardness of the annealed samples but reduces their electrical conductivity and overall texture intensity. The Al6(FeMn, Re) phase pins grain boundaries and enhances the thermal stability of the microstructure of the annealed samples. The CubeND texture {φ1 = 20°, φ = 0°, φ2 = 0°} exhibits high thermal stability. The formation of submicron dimple bands (SDB) and reinforced tear edges (RTE) contributes to improving the room-temperature and high-temperature tensile strength of the alloy.