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<p>Al/Cu composite is of utmost interest to the electronic industry for its superior functionality, but the formation mechanisms of the various features in the bonding zones remain unclear. Here, AA1060 foil and Cu plate were composited by self-development explosive welding, and the micro morphologies, grain properties, and thermodynamic behaviors at the bonding interface were thoroughly investigated by integrating multi-scale characterization methods and numerical simulation. It was found that the discontinuous melting layers with a thickness of ~ 40&#xa0;μm were formed at the bonding interface, which were dominated by two types of intermetallic compounds of AlCu and Al<sub>2</sub>Cu<sub>3</sub>. There are lots of holes, cracks, and fragments inside the melting layer, and their formation mechanisms were revealed in detail. Near the Al/Cu interface, the grains at the AA1060 side were elongated along the blast direction and showed a long stripy shape, while the Cu side mainly consisted of large-sized equiaxed grains. The melting layer mainly consisted of tiny equiaxed grains, due to the recrystallization process. The simulation results demonstrated the average temperature of ~ 1200&#xa0;K, the pressure of ~ 3&#xa0;GPa, and the plastic strain up to ~ 2.0 at the bonding zone, which could well explain the observed interface characteristics.</p>

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Experimental and numerical investigation on bonding zone of Al foil/Cu composite prepared by explosive welding

  • 期刊论文

  • 发表日期：

    2025年8月8日

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  • Junguo Wang,
  • Cong Wang,
  • Mengyang Li,
  • Xiaofei Wang,
  • Ming Yang

摘要

Al/Cu composite is of utmost interest to the electronic industry for its superior functionality, but the formation mechanisms of the various features in the bonding zones remain unclear. Here, AA1060 foil and Cu plate were composited by self-development explosive welding, and the micro morphologies, grain properties, and thermodynamic behaviors at the bonding interface were thoroughly investigated by integrating multi-scale characterization methods and numerical simulation. It was found that the discontinuous melting layers with a thickness of ~ 40 μm were formed at the bonding interface, which were dominated by two types of intermetallic compounds of AlCu and Al2Cu3. There are lots of holes, cracks, and fragments inside the melting layer, and their formation mechanisms were revealed in detail. Near the Al/Cu interface, the grains at the AA1060 side were elongated along the blast direction and showed a long stripy shape, while the Cu side mainly consisted of large-sized equiaxed grains. The melting layer mainly consisted of tiny equiaxed grains, due to the recrystallization process. The simulation results demonstrated the average temperature of ~ 1200 K, the pressure of ~ 3 GPa, and the plastic strain up to ~ 2.0 at the bonding zone, which could well explain the observed interface characteristics.