Improved Switching Characteristics of 1.2 kV P-Shielded Split Gate SiC MOSFETs
摘要
1.2 kV P-shielded Split Gate SiC MOSFETs (PSG-MOSFETs) were designed to achieve a reduced reverse transfer capacitance (Crss) and to effectively suppress electric field crowding at the gate oxide. The formation of the P-shielding region of PSG-MOSFETs was achieved without the necessity of an additional photo mask. The effect of the maximum electric field at the gate oxide (Eox,max) and specific on-resistance (Ron,sp) by the P-shielding region was investigated by varying the width of the P-shielding region (WP). As the WP increases, the Eox,max is reduced due to the suppression of the electric field at the gate oxide. Conversely, the Ron,sp increases due to the narrower current path in the JFET region. Furthermore, a comparative analysis of the simulated Crss and gate-drain charge was conducted, and the reduced total switching energy losses (Etotal) of PSG-MOSFETs were verified via the simulation of a double pulse test. The PSG-MOSFET exhibited lower Eox,max, Crss, and Etotal in comparison to the Split Gate SiC MOSFET.