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<p>Achieving a superior combination of strength and electrical conductivity in carbon nanotubes (CNTs) reinforced Cu matrix composites remains a significant challenge, primarily due to CNTs agglomeration and poor interfacial bonding. This study introduces a systematic integrated processing route combining Cu powder morphology control with a two-stage ball milling process. By rationally integrating validated powder processing steps and optimizing key process parameters, we directly address the long-standing strength–conductivity trade-off in CNTs/Cu composites. Dendritic Cu powder was first transformed into flake-shaped particles via pre-ball milling, increasing its specific surface area to enhance subsequent CNTs adhesion. A secondary ball milling step was applied to the CNTs/Cu flake mixture, effectively embedding CNTs into the matrix. Compared to composites prepared using dendritic or flake-shaped Cu powder alone, the composite subjected to the two-stage ball milling process exhibited a more homogeneous CNTs dispersion, reduced agglomeration, and enhanced interfacial bonding. Consequently, this optimized composite demonstrated a superior balance of tensile strength and electrical conductivity, offering a scalable pathway for fabricating high-performance CNTs/Cu composites.</p>

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Synergistic optimization of strength–conductivity balance in CNTs/Cu composites via powder morphology pre-regulation and two-stage ball milling

  • 期刊论文

  • 发表日期：

    2026年5月4日

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  • Wei Liu,
  • Chao Lei,
  • Yunna Zhang,
  • Zhenlin Lu,
  • Hui Xie,
  • Lei Jia

摘要

Achieving a superior combination of strength and electrical conductivity in carbon nanotubes (CNTs) reinforced Cu matrix composites remains a significant challenge, primarily due to CNTs agglomeration and poor interfacial bonding. This study introduces a systematic integrated processing route combining Cu powder morphology control with a two-stage ball milling process. By rationally integrating validated powder processing steps and optimizing key process parameters, we directly address the long-standing strength–conductivity trade-off in CNTs/Cu composites. Dendritic Cu powder was first transformed into flake-shaped particles via pre-ball milling, increasing its specific surface area to enhance subsequent CNTs adhesion. A secondary ball milling step was applied to the CNTs/Cu flake mixture, effectively embedding CNTs into the matrix. Compared to composites prepared using dendritic or flake-shaped Cu powder alone, the composite subjected to the two-stage ball milling process exhibited a more homogeneous CNTs dispersion, reduced agglomeration, and enhanced interfacial bonding. Consequently, this optimized composite demonstrated a superior balance of tensile strength and electrical conductivity, offering a scalable pathway for fabricating high-performance CNTs/Cu composites.