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<p>Kovar/Cu composites offer an effective approach to enhance the electrical and thermal conductivity of single Kovar alloy. Kovar/Cu composites with 25 vol.% Cu were fabricated via vacuum brazing using BAg45CuZn (S-45) and BAg72Cu (S-72) fillers. The joints exhibited a typical Kovar/diffusion layer/Cu-rich/Ag-rich/Cu-rich/TU1 configuration. In Sample BAg45CuZn (S-45), approximately 60&#xa0;μm intergranular diffusion layer was observed, while Sample BAg72Cu (S-72) showed a thicker Ag-rich layer at the center. Mutual diffusion between filler and base metals led to metallurgical bonding. At room temperature, Sample S-45 showed electrical conductivity of 1.51 × 10<sup>7</sup> S/m and thermal conductivity of 105.5 W/(m K), approximately 7.3 and 5.4 times higher than those of Kovar alloy, respectively. Below the Curie temperature, the composite exhibits an average coefficient of thermal expansion of 6.85 × 10<sup>−6&#xa0;</sup>°C<sup>−1</sup>, which is approximately 15% higher than that of Kovar alloy. These results demonstrate that Zn-containing filler reduces Ag segregation, enhances metallurgical bonding, and improves the mechanical and physical performance of Kovar/Cu composites.</p>

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Microstructure and properties of Kovar/Cu composites prepared by vacuum brazing

  • 期刊论文

  • 发表日期：

    2026年7月9日

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  • Zi-Meng Xiao,
  • Qing-Xue Cui,
  • Ze-Xin Wang,
  • Liang-Yu Chen,
  • Wei-Gang Lv,
  • Oleksandr Dobuvyy,
  • Feng-Ze Pan,
  • Gridasova Ekaterina

摘要

Kovar/Cu composites offer an effective approach to enhance the electrical and thermal conductivity of single Kovar alloy. Kovar/Cu composites with 25 vol.% Cu were fabricated via vacuum brazing using BAg45CuZn (S-45) and BAg72Cu (S-72) fillers. The joints exhibited a typical Kovar/diffusion layer/Cu-rich/Ag-rich/Cu-rich/TU1 configuration. In Sample BAg45CuZn (S-45), approximately 60 μm intergranular diffusion layer was observed, while Sample BAg72Cu (S-72) showed a thicker Ag-rich layer at the center. Mutual diffusion between filler and base metals led to metallurgical bonding. At room temperature, Sample S-45 showed electrical conductivity of 1.51 × 107 S/m and thermal conductivity of 105.5 W/(m K), approximately 7.3 and 5.4 times higher than those of Kovar alloy, respectively. Below the Curie temperature, the composite exhibits an average coefficient of thermal expansion of 6.85 × 10−6 °C−1, which is approximately 15% higher than that of Kovar alloy. These results demonstrate that Zn-containing filler reduces Ag segregation, enhances metallurgical bonding, and improves the mechanical and physical performance of Kovar/Cu composites.