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<p>Here, we propose a synergistic V-groove anchoring array-repeated hot-pressing process that constructs high-continuity, low-percolation PP/CP/NP-CF/MWCNT quaternary conductive networks in polypropylene (PP) via dual spatial confinement and cyclic stress densification mechanisms. A 90° V-groove mold immobilizes 2 vol% copper particles (CP) as periodic conductive nodes, induces 2–18 vol% nickel-plated carbon fibers (NP-CF) to align along grooves for primary conductive paths, and employs 1 vol% multi-walled carbon nanotubes (MWCNTs) to bridge microscale filler gaps. Cyclic compression in repeated hot pressing eliminates interfacial voids and reorganizes fillers; benefiting from V-groove spatial confinement, preliminary three-dimensional interwoven conductive frameworks can be formed merely at a moderate NP-CF loading of 6 vol%, which accelerates the transition from oriented two-dimensional (2D) networks to dense interconnected three-dimensional (3D) architectures. Systematic characterization covering electrical anisotropy, tensile mechanical properties and thermal stability were carried out combined with microstructure observations and theoretical modeling based on the Hertz–Holm contact resistance and stochastic resistor network theories. At a low filler loading (6 vol% NP-CF, 2 vol% CP, 1 vol% MWCNT), 0.4&#xa0;mm-thick composites attained a conductivity of 80&#xa0;S/m, over 205-fold higher than conventionally molded counterparts. V-groove confined samples exhibit approximately 19% higher tensile strength and approximately 112% improved elongation at break, as well as improved thermal decomposition resistance. The experimental outcomes agreed with the theoretical framework proposed to describe the multiscale interconnected filler network formed. This work offers a universal, engineering-feasible route to fabricate mechanically robust, structurally tunable conductive polymer composites with low filler loading.</p>

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Mechanism for the controlled assembly and performance enhancement of multi-scale electrically conductive fillers based on a v-groove anchoring array repeated hot pressing method

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年8月1日

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  • Guangqi Lu,
  • Glen Thompson,
  • Jiayu Hu,
  • Ben Richard Whiteside,
  • Chaoying Wan,
  • Jixiang Wan,
  • Jingyao Sun,
  • Yao Huang,
  • Tony McNally

摘要

Here, we propose a synergistic V-groove anchoring array-repeated hot-pressing process that constructs high-continuity, low-percolation PP/CP/NP-CF/MWCNT quaternary conductive networks in polypropylene (PP) via dual spatial confinement and cyclic stress densification mechanisms. A 90° V-groove mold immobilizes 2 vol% copper particles (CP) as periodic conductive nodes, induces 2–18 vol% nickel-plated carbon fibers (NP-CF) to align along grooves for primary conductive paths, and employs 1 vol% multi-walled carbon nanotubes (MWCNTs) to bridge microscale filler gaps. Cyclic compression in repeated hot pressing eliminates interfacial voids and reorganizes fillers; benefiting from V-groove spatial confinement, preliminary three-dimensional interwoven conductive frameworks can be formed merely at a moderate NP-CF loading of 6 vol%, which accelerates the transition from oriented two-dimensional (2D) networks to dense interconnected three-dimensional (3D) architectures. Systematic characterization covering electrical anisotropy, tensile mechanical properties and thermal stability were carried out combined with microstructure observations and theoretical modeling based on the Hertz–Holm contact resistance and stochastic resistor network theories. At a low filler loading (6 vol% NP-CF, 2 vol% CP, 1 vol% MWCNT), 0.4 mm-thick composites attained a conductivity of 80 S/m, over 205-fold higher than conventionally molded counterparts. V-groove confined samples exhibit approximately 19% higher tensile strength and approximately 112% improved elongation at break, as well as improved thermal decomposition resistance. The experimental outcomes agreed with the theoretical framework proposed to describe the multiscale interconnected filler network formed. This work offers a universal, engineering-feasible route to fabricate mechanically robust, structurally tunable conductive polymer composites with low filler loading.