<p>Rotational computed laminography (CL) has broad application potential in three-dimensional imaging of plate-like objects because it only requires X-rays to pass through the tested object in the thickness direction during the imaging process. In this study, a rectangular cross-section field-of-view rotational CL (RC-CL) is proposed for circuit board imaging. Compared to other rotational CL systems, the field of view is the largest and most suitable for rectangular circuit boards. Meanwhile, as the imaging geometry of RC-CL is significantly different from that of cone-beam CT, the Feldkamp–Davis–Kress (FDK) reconstruction algorithm cannot be used directly. However, transferring the projection data to fit into the CBCT geometry using two-dimensional interpolation introduces interpolation errors. Therefore, an FDK-type analytical reconstruction algorithm applicable to RC-CL was developed. The effectiveness of the method was validated through numerical experiments, and the influence of the tilt angle on the reconstruction results was analyzed. Finally, the RC-CL technique was applied to real defect detection research on circuit boards.</p>