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<p>This study applies the Taguchi method to enhance thermal conductivity in Fused Deposition Modeling (FDM)-printed materials. Polylactic acid (PLA), copper-infused PLA (PLA/Cu), and wood-fiber-reinforced PLA (PLA/wood) were evaluated under varying infill density (40–100%) and layer thickness (0.2–0.4&#xa0;mm). The study emphasizes the importance of multi-replication for obtaining reliable measurements, as it helps mitigate experimental variability. The results indicate that infill density significantly impacts heat transfer (with up to 100% infill) yielding higher conductivity across all materials for the three replications. The conductivity of PLA composites is significantly impacted by the infill density. In order for PLA/Cu to demonstrate better conductivity (0.32&#xa0;W/m·K), a layer thickness of 0.4&#xa0;mm was necessary. Among the thermal performance, especially at thicker layer settings, making it a strong candidate composite, PLA/Cu exhibited superior applications requiring enhanced heat dissipation, such as heat exchangers and electronic enclosures. Furthermore, the findings hold significant implications for industries including automotive, aerospace, and biomedical devices, where heat management is critical. In addition, PLA/wood have an intermediate thermal conductivity and are suitable for applications where a compromise between thermal insulation and durability is required. </p>

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Optimizing thermal conductivity in 3D-printed composites via Taguchi parameter analysis

  • 期刊论文

  • 发表日期：

    2025年8月13日

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  • Maroua Jabeur,
  • Rania Ben Amor,
  • Slim Souissi,
  • Ons Hamdaoui,
  • Ahmed Elloumi

摘要

This study applies the Taguchi method to enhance thermal conductivity in Fused Deposition Modeling (FDM)-printed materials. Polylactic acid (PLA), copper-infused PLA (PLA/Cu), and wood-fiber-reinforced PLA (PLA/wood) were evaluated under varying infill density (40–100%) and layer thickness (0.2–0.4 mm). The study emphasizes the importance of multi-replication for obtaining reliable measurements, as it helps mitigate experimental variability. The results indicate that infill density significantly impacts heat transfer (with up to 100% infill) yielding higher conductivity across all materials for the three replications. The conductivity of PLA composites is significantly impacted by the infill density. In order for PLA/Cu to demonstrate better conductivity (0.32 W/m·K), a layer thickness of 0.4 mm was necessary. Among the thermal performance, especially at thicker layer settings, making it a strong candidate composite, PLA/Cu exhibited superior applications requiring enhanced heat dissipation, such as heat exchangers and electronic enclosures. Furthermore, the findings hold significant implications for industries including automotive, aerospace, and biomedical devices, where heat management is critical. In addition, PLA/wood have an intermediate thermal conductivity and are suitable for applications where a compromise between thermal insulation and durability is required.