Performance analysis of triply periodic minimal surface heat sinks using TPMS-fin composite structures
摘要
Thermal management of next-generation high-power microelectronics is increasingly volume-constrained, necessitating advanced hierarchical heat sink topologies. This study proposes a systematic numerical and experimental methodology to evaluate Triply Periodic Minimal Surface (TPMS) architectures augmented with Fins Occupying the Perforated Structure (FOPS). A parametric family of TFS-Gyroid manifolds, with fin heights (HTFS-Gyroid) ranging from 0 to 1.6 mm, was generated and evaluated under forced air cooling. The thermo-hydraulic analysis elucidates a critical engineering trade-off dependent on operational constraints. Under strict energy constraints (e.g., a pumping power of 0.1 W), the intermediate HTFS-Gyroid = 0.5 mm configuration maintains optimal efficiency with a total thermal resistance of 1.47 K/W, compared to 1.64 K/W for the baseline Gyroid (HTFS-Gyroid = 0 mm). Under volume-constrained scenarios, the HTFS-Gyroid = 1.4 mm architecture achieves a peak heat dissipation of 230.2 W (+ 24.2% over baseline) within a compact 20 × 20 × 80 mm footprint. These results establish a constraint-driven dual-branch design guideline for selecting hierarchical TPMS heat sinks in application-specific thermal and geometric environments.