Embedding of taggants in the vat photo-polymerisation additive manufacturing process for anti-counterfeiting measures
摘要
The rapid expansion of the additive manufacturing (AM) industry has attracted significant global attention. However, the inherent nature of AM, specifically the direct translation of CAD data into physical components, makes the supply chain highly vulnerable to fraudulent and counterfeit activities. As scanning and reverse-engineering technologies advance, existing authentication methods have become increasingly susceptible to replication, and consequently, unreliable. This article investigates a novel authentication method for the vat photo-polymerisation process (VPP) by introducing a “double-lock” system. This system embeds both a physical hash (randomly distributed taggants acting as physically unclonable functions) and a digital hash (derived from X-ray computed tomography scans) into each component. Several digital hashing methods are proposed, including a combination of taggant spatial coordinates, colour codes, and quadrat counts, creating a signature that demonstrates substantial spatial complexity and resistance to physical replication. The chi-square (χ2) value of the distribution can also be utilised as a supplemental digital hash. The study indicates that the embedded physical taggants had no discernible effect on the thermal properties of the parts, and exerted minimal impact on mechanical strength. Specifically, reductions in ultimate tensile strength (UTS) at room temperature were limited to 3.1 ± 0.8 %, 3.9 ± 1.1 %, and 1.0 ± 1.0 % for layer thicknesses of 100, 50, and 25 μm, respectively. While the UTS for all samples decreased with increasing temperature, the presence of taggants did not affect the UTS beyond the standard margin of error across most testing conditions. The exceptions were samples tested at 23 °C and 180 °C, which exhibited UTS variations of 4.0 ± 1.3 % and 17.4 ± 3.8 %, respectively, between samples with and without taggants. Overall, the double-lock system developed in this study maintains a high level of security with minimal sacrifice to the components’ thermal and mechanical properties.