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<p>Cracking during directed energy deposition limits the processability of components fabricated from high γ′ Ni-based superalloys and demands prediction tools that are both accurate and transparent while computationally efficient. This work develops a lightweight, data-driven framework that correlates in-situ infrared (IR) thermal histories to crack susceptibility in IN625–IN100 graded alloy mixtures spanning compositions with varying γ′-forming precursors (Al, Ti). Thirty-three thin walls were deposited across a range of compositions and process parameters, generating diverse thermal histories for analysis. The pipeline comprises four modules: (i) extraction and alignment of pixel-level IR thermal histories (9 × 27 grid) from identical locations of each deposit, (ii) PCA-based compression of 891 layer-level profiles into low-dimensional thermal-history descriptors (first ten PCs explain &gt; 90% variance), (iii) crack-susceptibility classification using composition/process inputs with and without PC scores (CP-P, CPS-P, and CS-P), and (iv) crack-probability mapping over the composition–parameter space. Using standardized inputs, the best-performing configuration (composition + process + PC scores) with a Gaussian Process classifier (ARDSE kernel) achieved accuracy = 0.96 (F1 = 0.92; recall = 0.92), while composition + PC scores performed comparably, indicating that thermal histories largely subsume nominal process metadata. Feature-relevance analyses (Random-Forest importances and ARDSE per-feature length-scales) consistently ranked low-order PC scores and composition as most influential. The resulting maps reveal sharp susceptibility transitions near ~ 87.5 wt% IN100 under no-dwell and strong mitigation with a 10&#xa0;s dwell, highlighting the utility of compact thermal descriptors for process planning and in-situ quality assurance in metal additive manufacturing.</p>

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An interpretable machine learning framework for the prediction of cracking in additively manufactured high gamma-prime nickel-based superalloys

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年4月2日

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  • Venkata Surya Karthik Adapa,
  • Alan Burl,
  • Kyle Saleeby,
  • Surya R. Kalidindi,
  • Christopher J. Saldana

摘要

Cracking during directed energy deposition limits the processability of components fabricated from high γ′ Ni-based superalloys and demands prediction tools that are both accurate and transparent while computationally efficient. This work develops a lightweight, data-driven framework that correlates in-situ infrared (IR) thermal histories to crack susceptibility in IN625–IN100 graded alloy mixtures spanning compositions with varying γ′-forming precursors (Al, Ti). Thirty-three thin walls were deposited across a range of compositions and process parameters, generating diverse thermal histories for analysis. The pipeline comprises four modules: (i) extraction and alignment of pixel-level IR thermal histories (9 × 27 grid) from identical locations of each deposit, (ii) PCA-based compression of 891 layer-level profiles into low-dimensional thermal-history descriptors (first ten PCs explain > 90% variance), (iii) crack-susceptibility classification using composition/process inputs with and without PC scores (CP-P, CPS-P, and CS-P), and (iv) crack-probability mapping over the composition–parameter space. Using standardized inputs, the best-performing configuration (composition + process + PC scores) with a Gaussian Process classifier (ARDSE kernel) achieved accuracy = 0.96 (F1 = 0.92; recall = 0.92), while composition + PC scores performed comparably, indicating that thermal histories largely subsume nominal process metadata. Feature-relevance analyses (Random-Forest importances and ARDSE per-feature length-scales) consistently ranked low-order PC scores and composition as most influential. The resulting maps reveal sharp susceptibility transitions near ~ 87.5 wt% IN100 under no-dwell and strong mitigation with a 10 s dwell, highlighting the utility of compact thermal descriptors for process planning and in-situ quality assurance in metal additive manufacturing.